Vulnerabilities > Qualcomm > Sd210 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-03-10 | CVE-2022-22075 | Unspecified vulnerability in Qualcomm products Information Disclosure in Graphics during GPU context switch. | 5.5 |
| 2023-01-09 | CVE-2022-22079 | Out-of-bounds Read vulnerability in Qualcomm products Denial of service while processing fastboot flash command on mmc due to buffer over read | 4.6 |
| 2023-01-09 | CVE-2022-25722 | Use After Free vulnerability in Qualcomm products Information exposure in DSP services due to improper handling of freeing memory | 5.5 |
| 2023-01-09 | CVE-2022-33255 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in Bluetooth HOST while processing GetFolderItems and GetItemAttribute Cmds from peer device. | 6.5 |
| 2022-10-19 | CVE-2022-25664 | Incomplete Cleanup vulnerability in Qualcomm products Information disclosure due to exposure of information while GPU reads the data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-10-19 | CVE-2022-25666 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free in service while trying to access maps by different threads in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2022-06-14 | CVE-2021-30342 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 5.9 |
| 2022-02-11 | CVE-2021-30324 | Classic Buffer Overflow vulnerability in Qualcomm products Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2022-02-11 | CVE-2021-30325 | Improper Validation of Array Index vulnerability in Qualcomm products Possible out of bound access of DCI resources due to lack of validation process and resource allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2022-01-13 | CVE-2021-30313 | Use After Free vulnerability in Qualcomm products Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.4 |