Vulnerabilities > Qualcomm > Sd205 Firmware > Medium

DATE CVE VULNERABILITY TITLE RISK
2023-03-10 CVE-2022-22075 Unspecified vulnerability in Qualcomm products
Information Disclosure in Graphics during GPU context switch.
local
low complexity
qualcomm
5.5
2023-01-09 CVE-2022-25722 Use After Free vulnerability in Qualcomm products
Information exposure in DSP services due to improper handling of freeing memory
local
low complexity
qualcomm CWE-416
5.5
2023-01-09 CVE-2022-33255 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer over-read in Bluetooth HOST while processing GetFolderItems and GetItemAttribute Cmds from peer device.
low complexity
qualcomm CWE-125
6.5
2022-10-19 CVE-2022-25664 Incomplete Cleanup vulnerability in Qualcomm products
Information disclosure due to exposure of information while GPU reads the data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-459
5.5
2022-10-19 CVE-2022-25666 Use After Free vulnerability in Qualcomm products
Memory corruption due to use after free in service while trying to access maps by different threads in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
6.7
2022-06-14 CVE-2021-30342 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables
network
high complexity
qualcomm CWE-367
5.9
2022-02-11 CVE-2021-30324 Classic Buffer Overflow vulnerability in Qualcomm products
Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-120
6.7
2022-02-11 CVE-2021-30325 Improper Validation of Array Index vulnerability in Qualcomm products
Possible out of bound access of DCI resources due to lack of validation process and resource allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-129
6.7
2022-01-13 CVE-2021-30313 Use After Free vulnerability in Qualcomm products
Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
high complexity
qualcomm CWE-416
6.4
2022-01-13 CVE-2021-30314 Information Exposure vulnerability in Qualcomm products
Lack of validation for third party application accessing the service can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-200
5.5