Vulnerabilities > Qualcomm > SD 8CX Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2023-28564 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while passing command parameters through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28565 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command streams through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28567 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command through WMI interfaces. | 7.8 |
| 2023-08-08 | CVE-2023-21651 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE. | 7.8 |
| 2023-06-06 | CVE-2022-33307 | Double Free vulnerability in Qualcomm products Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed. | 7.8 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2022-40529 | Incorrect Authorization vulnerability in Qualcomm products Memory corruption due to improper access control in kernel while processing a mapping request from root process. | 7.8 |
| 2023-06-06 | CVE-2023-21628 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | 7.8 |
| 2023-06-06 | CVE-2023-21659 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing frames with missing header fields. | 7.5 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |