Vulnerabilities > Qualcomm > SD 845 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2018-04-11 | CVE-2018-3590 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, a Use After Free condition can occur in RIL while handling requests from Android. | 9.8 |
| 2018-04-11 | CVE-2018-3589 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 835, SD 845, SD 850, the vswr capture size is larger than the maximum size of a diag logPacket, which can lead to a buffer overflow when the sample buffer is copied to the logPacket buffer. | 9.8 |
| 2018-04-11 | CVE-2017-18146 | Improper Verification of Cryptographic Signature vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail. | 9.8 |
| 2018-04-11 | CVE-2017-18145 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. | 9.8 |
| 2018-04-11 | CVE-2017-18144 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. | 9.8 |
| 2018-04-11 | CVE-2017-18143 | Unspecified vulnerability in Qualcomm SD 845 Firmware and SD 850 Firmware In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile SD 845, SD 850, on a secure device, PD dumps are collected when debugging is not enabled. | 7.5 |
| 2018-04-11 | CVE-2017-18142 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 835, SD 845, SD 850, while processing the IMS SIP username, a buffer overflow can occur. | 9.8 |
| 2018-04-11 | CVE-2017-18140 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. | 9.8 |
| 2018-04-11 | CVE-2017-18139 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. | 9.8 |
| 2018-04-11 | CVE-2017-18138 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur. | 9.8 |