Vulnerabilities > Qualcomm > SD 8 Gen1 5G Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-09-02 | CVE-2024-33052 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when user provides data for FM HCI command control operations. | 7.8 |
| 2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
| 2024-09-02 | CVE-2024-38402 | Use After Free vulnerability in Qualcomm products Memory corruption while processing IOCTL call for getting group info. | 7.8 |
| 2024-08-05 | CVE-2024-23355 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when keymaster operation imports a shared key. | 7.8 |
| 2024-08-05 | CVE-2024-23382 | Use After Free vulnerability in Qualcomm products Memory corruption while processing graphics kernel driver request to create DMA fence. | 7.8 |
| 2024-08-05 | CVE-2024-33023 | Use After Free vulnerability in Qualcomm products Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events. | 7.8 |
| 2024-08-05 | CVE-2024-33034 | Use After Free vulnerability in Qualcomm products Memory corruption can occur if VBOs hold outdated or invalid GPU SMMU mappings, especially when the binding and reclaiming of memory buffers are performed at the same time. | 7.8 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |