Vulnerabilities > Qualcomm > SD 8 Gen1 5G Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-03-10 | CVE-2022-25694 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Modem due to usage of Out-of-range pointer offset in UIM | 7.8 |
| 2023-03-10 | CVE-2022-25705 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in modem due to integer overflow to buffer overflow while handling APDU response | 7.8 |
| 2023-03-10 | CVE-2022-25709 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in modem due to use of out of range pointer offset while processing qmi msg | 7.8 |
| 2023-03-10 | CVE-2022-33213 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in modem due to buffer overflow while processing a PPP packet | 8.8 |
| 2023-03-10 | CVE-2022-33242 | Improper Authentication vulnerability in Qualcomm products Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD. | 7.8 |
| 2023-03-10 | CVE-2022-33244 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in modem during MIB reception and SIB timeout | 7.5 |
| 2023-03-10 | CVE-2022-33250 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in modem when network repeatedly sent invalid message container for NR to LTE handover. | 7.5 |
| 2023-03-10 | CVE-2022-33254 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem while processing SIB1 Message. | 7.5 |
| 2023-03-10 | CVE-2022-33256 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in Multi-mode call processor. | 9.8 |
| 2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |