Vulnerabilities > Qualcomm > SD 675 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2021-06-09 | CVE-2020-11176 | Out-of-bounds Write vulnerability in Qualcomm products While processing server certificate from IPSec server, certificate validation for subject alternative name API can cause heap overflow which can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile | 9.8 |
2021-06-09 | CVE-2020-11267 | Out-of-bounds Write vulnerability in Qualcomm products Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
2021-06-09 | CVE-2020-11291 | Improper Validation of Array Index vulnerability in Qualcomm products Possible buffer overflow while updating ikev2 parameters for delete payloads received during informational exchange due to lack of check of input validation for certain parameters received from the ePDG server in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile | 9.8 |
2021-06-09 | CVE-2020-11292 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow in voice service due to lack of input validation of parameters in QMI Voice API in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2021-06-09 | CVE-2020-11298 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products While waiting for a response to a callback or listener request, non-secure clients can change permissions to shared memory buffers used by HLOS Invoke Call to secure kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.0 |
2021-06-09 | CVE-2020-11304 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read in DRM due to improper buffer length check. | 7.1 |
2021-06-09 | CVE-2020-11306 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow in RPMB counter due to lack of length check on user provided data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |
2021-06-09 | CVE-2021-1937 | Reachable Assertion vulnerability in Qualcomm products Reachable assertion is possible while processing peer association WLAN message from host and nonstandard incoming packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
2021-06-09 | CVE-2020-11126 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read while WLAN frame parsing due to lack of check for body and header length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 9.1 |
2021-06-09 | CVE-2020-11134 | Improper Validation of Array Index vulnerability in Qualcomm products Possible stack out of bound write might happen due to time bitmap length and bit duration fields of the attributes like NAN ranging setup attribute inside a NAN management frame are not Properly validated in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 9.8 |