Vulnerabilities > Qualcomm > SD 650 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2019-06-14 CVE-2018-13902 Improper Validation of Array Index vulnerability in Qualcomm products
Out of bounds memory read and access due to improper array index validation may lead to unexpected behavior while decoding XTRA file in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130
network
low complexity
qualcomm CWE-129
7.5
2019-06-14 CVE-2018-11939 Use After Free vulnerability in Qualcomm products
Use after issue in WLAN function due to multiple ACS scan requests at a time in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCA6574AU, SD 210/SD 212/SD 205, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SDX20
local
low complexity
qualcomm CWE-416
7.8
2019-05-24 CVE-2019-2248 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Buffer overflow can occur if invalid header tries to overwrite the existing buffer which fix size allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 820, SD 820A, SD 845 / SD 850, SDM439, SDM660, SDX20
local
low complexity
qualcomm CWE-119
7.8
2019-05-24 CVE-2019-2247 Double Free vulnerability in Qualcomm products
Possibility of double free issue while running multiple instances of smp2p test because of proper protection is missing while using global variable in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24
local
low complexity
qualcomm CWE-415
7.8
2019-05-24 CVE-2018-13895 Improper Access Control vulnerability in Qualcomm products
Due to the missing permissions on several content providers of the RCS app in its android manifest file will lead to an unprivileged access to phone in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20
local
low complexity
qualcomm CWE-284
7.8
2019-05-24 CVE-2018-11967 Unspecified vulnerability in Qualcomm products
Signature verification of the skel library could potentially be disabled as the memory region on the remote subsystem in which the library is loaded is allocated from userspace currently in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24
local
low complexity
qualcomm
7.8
2019-05-06 CVE-2017-18279 Integer Overflow or Wraparound vulnerability in Qualcomm products
Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016.
local
low complexity
qualcomm CWE-190
7.8
2019-05-06 CVE-2017-18278 Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850.
local
low complexity
qualcomm CWE-191
7.8
2019-05-06 CVE-2017-18274 Improper Validation of Array Index vulnerability in Qualcomm products
While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835
local
low complexity
qualcomm CWE-129
7.8
2019-05-06 CVE-2017-18157 Use After Free vulnerability in Qualcomm products
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
local
low complexity
qualcomm CWE-416
7.8