Vulnerabilities > Qualcomm > SD 636 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2019-07-25 | CVE-2019-2312 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products When handling the vendor command there exists a potential buffer overflow due to lack of input validation of data buffer received in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9607, MDM9640, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM630, SDM660, SDX24 | 7.8 |
2019-07-25 | CVE-2019-2308 | Unspecified vulnerability in Qualcomm products User application could potentially make RPC call to the fastrpc driver and the driver will allow the message to go through to the remote subsystem in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24 | 7.8 |
2019-07-25 | CVE-2019-2306 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Improper casting of structure while handling the buffer leads to out of bound read in display in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20 | 7.8 |
2019-07-25 | CVE-2019-2301 | Out-of-bounds Read vulnerability in Qualcomm products Possibility of out-of-bound read if id received from SPI is not in range of FIFO in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8064, MSM8909W, MSM8996AU, QCA9980, QCS605, Qualcomm 215, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 712 / SD 710 / SD 670, SD 820A, SD 845 / SD 850, SD 855, SDM439, SDM660, SDX24 | 7.8 |
2019-07-25 | CVE-2019-2299 | Out-of-bounds Write vulnerability in Qualcomm products An out-of-bound write can be triggered by a specially-crafted command supplied by a userspace application. | 7.8 |
2019-07-25 | CVE-2019-2298 | Use After Free vulnerability in Qualcomm products Protection is missing while accessing md sessions info via macro which can lead to use-after-free in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 845 / SD 850, SD 855, SDM660, SDX20, SDX24 | 7.8 |
2019-07-25 | CVE-2019-2293 | Use After Free vulnerability in Qualcomm products Pointer dereference while freeing IFE resources due to lack of length check of in port resource. | 7.8 |
2019-07-25 | CVE-2019-2290 | Use After Free vulnerability in Qualcomm products Multiple open and close from multiple threads will lead camera driver to access destroyed session data pointer in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDM660, SDX20, SDX24, Snapdragon_High_Med_2016 | 7.8 |
2019-07-25 | CVE-2019-2281 | Unspecified vulnerability in Qualcomm products An unauthenticated bitmap image can be loaded in to memory and subsequently cause execution of unverified code. | 7.8 |
2019-07-25 | CVE-2019-2278 | Improper Verification of Cryptographic Signature vulnerability in Qualcomm products User keystore signature is ignored in boot and can lead to bypass boot image signature verification in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile in MDM9607, MDM9640, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SDM660 | 7.8 |