Vulnerabilities > Qualcomm > SD 625 Firmware

DATE CVE VULNERABILITY TITLE RISK
2019-05-24 CVE-2018-11923 Integer Overflow or Wraparound vulnerability in Qualcomm products
Improper buffer length check before copying can lead to integer overflow and then a buffer overflow in WMA event handler in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24
local
low complexity
qualcomm CWE-190
7.8
2019-05-24 CVE-2018-11271 Improper Authentication vulnerability in Qualcomm products
Improper authentication can happen on Remote command handling due to inappropriate handling of events in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SM7150, Snapdragon_High_Med_2016, SXR1130
network
low complexity
qualcomm CWE-287
critical
9.8
2019-05-06 CVE-2017-18279 Integer Overflow or Wraparound vulnerability in Qualcomm products
Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016.
local
low complexity
qualcomm CWE-190
7.8
2019-05-06 CVE-2017-18278 Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850.
local
low complexity
qualcomm CWE-191
7.8
2019-05-06 CVE-2017-18275 Unspecified vulnerability in Qualcomm products
A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845.
local
low complexity
qualcomm
5.5
2019-05-06 CVE-2017-18274 Improper Validation of Array Index vulnerability in Qualcomm products
While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835
local
low complexity
qualcomm CWE-129
7.8
2019-05-06 CVE-2017-18173 Integer Overflow or Wraparound vulnerability in Qualcomm products
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
local
low complexity
qualcomm CWE-190
7.8
2019-05-06 CVE-2017-18157 Use After Free vulnerability in Qualcomm products
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
local
low complexity
qualcomm CWE-416
7.8
2019-05-06 CVE-2017-18156 Use After Free vulnerability in Qualcomm products
While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20.
local
low complexity
qualcomm CWE-416
7.8
2019-05-06 CVE-2017-18131 Improper Initialization vulnerability in Qualcomm products
In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016.
local
low complexity
qualcomm CWE-665
7.8