Vulnerabilities > Qualcomm > SD 615 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2018-04-18 | CVE-2014-10045 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear IPQ4019, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 615/16/SD 415, SD 820, and SDX20, buffer overflow vulnerability exist in Sahara boot when program header are parsing. | 9.8 |
| 2018-04-11 | CVE-2018-3594 | Out-of-bounds Read vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, while parsing a private frame in an ID3 tag, a buffer over-read can occur when comparing frame data with predefined owner identifier strings. | 9.8 |
| 2018-04-11 | CVE-2018-3593 | Double Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, repeated enable/disable eMBMS requests may result in a double free condition. | 9.8 |
| 2018-04-11 | CVE-2018-3591 | Insecure Default Initialization of Resource vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016, the default build configuration of deviceprogrammer in BOOT.BF.3.0 enables the flag SKIP_SECBOOT_CHECK_NOT_RECOMMENDED_BY_QUALCOMM which will open up the peek and poke commands to any memory location on the target. | 9.8 |
| 2018-04-11 | CVE-2018-3590 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, a Use After Free condition can occur in RIL while handling requests from Android. | 9.8 |
| 2018-04-11 | CVE-2017-18146 | Improper Verification of Cryptographic Signature vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail. | 9.8 |
| 2018-04-11 | CVE-2017-18145 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. | 9.8 |
| 2018-04-11 | CVE-2017-18144 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. | 9.8 |
| 2018-04-11 | CVE-2017-18140 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. | 9.8 |
| 2018-04-11 | CVE-2017-18139 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. | 9.8 |