Vulnerabilities > Qualcomm > SD 412 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-11-06 | CVE-2019-2275 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 | 5.5 |
| 2019-09-30 | CVE-2019-2294 | Use of Insufficiently Random Values vulnerability in Qualcomm products Usage of hard-coded magic number for calculating heap guard bytes can allow users to corrupt heap blocks without heap algorithm knowledge in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9655, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 | 9.8 |
| 2019-07-25 | CVE-2019-2241 | Improper Handling of Exceptional Conditions vulnerability in Qualcomm products While rendering the layout background, Error status check is not caught properly and also incorrect status handling is being done leading to unintended SUI behaviour in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SDX24, SXR1130 | 5.5 |
| 2019-07-25 | CVE-2019-2239 | Improper Validation of Array Index vulnerability in Qualcomm products Sanity checks are missing in layout which can lead to SUI Corruption or can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24, Snapdragon_High_Med_2016, SXR1130 | 5.5 |
| 2019-07-25 | CVE-2019-2238 | Out-of-bounds Write vulnerability in Qualcomm products Lack of check of data type can lead to subsequent loop-expression potentially go negative and the condition will still evaluate to true leading to buffer underflow. | 7.8 |
| 2019-07-25 | CVE-2019-2237 | 7PK - Errors vulnerability in Qualcomm products Failure in taking appropriate action to handle the error case If keypad gpio deactivation fails leads to silent failure scenario and subsequent logic gets executed everytime in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 8CX, SXR1130 | 5.5 |
| 2019-07-25 | CVE-2019-2236 | NULL Pointer Dereference vulnerability in Qualcomm products Null pointer dereference during secure application termination using specific application ids. | 5.5 |
| 2019-07-25 | CVE-2019-2235 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Buffer overflow occurs when emulated RPMB is used due to sector size assumptions in the TA rollback protection logic. | 7.8 |
| 2019-07-22 | CVE-2018-13927 | Improper Authentication vulnerability in Qualcomm products Debug policy with invalid signature can be loaded when the debug policy functionality is disabled by using the parallel image loading in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, SD 410/12, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SXR1130 | 7.8 |
| 2019-07-22 | CVE-2018-13896 | Improper Access Control vulnerability in Qualcomm products XBL_SEC image authentication and other crypto related validations are accessible to a compromised OEM XBL Loader due to missing lock at XBL_SEC stage.. | 7.8 |