Vulnerabilities > Qualcomm > SD 400 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2018-04-18 | CVE-2014-10044 | Improper Validation of Array Index vulnerability in Qualcomm products In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile MDM9615, MDM9625, MDM9635M, SD 210/SD 212/SD 205, SD 400, SD 617, SD 800, and SD 820, in the time daemon, unauthorized users can potentially modify system time and cause an array index to be out-of-bound. | 7.5 |
| 2018-04-18 | CVE-2014-10043 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, and SD 800, while reading PlayReady rights string information from command buffer (which is sent from non-secure side), if length of rights string is very large, a buffer over read occurs, exposing TZ App memory to non-secure side. | 7.5 |
| 2018-04-18 | CVE-2014-10039 | Data Processing Errors vulnerability in Qualcomm Mdm9625 Firmware, SD 400 Firmware and SD 800 Firmware In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile MDM9625, SD 400, and SD 800, calling qsee_app_entry_return() without first calling qsee_app_entry() will cause the stack to be restored to an older state resulting in a return to an unexpected location. | 9.8 |
| 2018-04-11 | CVE-2018-3593 | Double Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, repeated enable/disable eMBMS requests may result in a double free condition. | 9.8 |
| 2018-04-11 | CVE-2017-8275 | Integer Overflow or Wraparound vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile SD 210/SD 212/SD 205, SD 400, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 820, SD 835, an integer overflow vulnerability exists in a video library. | 9.8 |
| 2018-04-11 | CVE-2017-18146 | Improper Verification of Cryptographic Signature vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail. | 9.8 |
| 2018-04-11 | CVE-2017-18140 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. | 9.8 |
| 2018-04-11 | CVE-2017-18139 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. | 9.8 |
| 2018-04-11 | CVE-2017-18138 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur. | 9.8 |
| 2018-04-11 | CVE-2017-18136 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, in the omx aac component, a Use After Free condition may potentially occur. | 9.8 |