Vulnerabilities > Qualcomm > SD 212 Firmware > Medium

DATE CVE VULNERABILITY TITLE RISK
2019-01-03 CVE-2017-18326 Information Exposure vulnerability in Qualcomm products
Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016.
local
low complexity
qualcomm CWE-200
5.5
2019-01-03 CVE-2017-18324 Information Exposure vulnerability in Qualcomm products
Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016.
local
low complexity
qualcomm CWE-200
5.5
2019-01-03 CVE-2017-18323 Key Management Errors vulnerability in Qualcomm products
Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.
local
low complexity
qualcomm CWE-320
5.5
2019-01-03 CVE-2017-18322 Information Exposure vulnerability in Qualcomm products
Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016.
local
low complexity
qualcomm CWE-200
5.5
2019-01-03 CVE-2017-18319 Key Management Errors vulnerability in Qualcomm products
Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016.
local
low complexity
qualcomm CWE-320
5.5
2019-01-03 CVE-2017-11004 Unspecified vulnerability in Qualcomm products
A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
local
low complexity
qualcomm
5.5
2018-11-28 CVE-2018-5916 Out-of-bounds Read vulnerability in Qualcomm products
Buffer overread while decoding PDP modify request or network initiated secondary PDP activation in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDA845, SDX20, SXR1130.
low complexity
qualcomm CWE-125
6.5
2018-10-26 CVE-2018-11846 Information Exposure vulnerability in Qualcomm products
The use of a non-time-constant memory comparison operation can lead to timing/side channel attacks in Snapdragon Mobile in version SD 210/SD 212/SD 205, SD 845, SD 850
local
high complexity
qualcomm CWE-200
4.7
2018-10-23 CVE-2017-18313 Unspecified vulnerability in Qualcomm products
Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.
high complexity
qualcomm
5.3
2018-10-23 CVE-2017-18300 Information Exposure vulnerability in Qualcomm products
Secure display content could be accessed by third party trusted application after creating a fault in other trusted applications in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SDA660.
local
low complexity
qualcomm CWE-200
5.5