Vulnerabilities > Qualcomm > SD 212 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2019-02-11 CVE-2018-13888 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
local
low complexity
qualcomm CWE-119
7.2
2019-02-11 CVE-2018-11888 Missing Authorization vulnerability in Qualcomm products
Unauthorized access may be allowed by the SCP11 Crypto Services TA will processing commands from other TA in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile and Snapdragon Voice & Music in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439, Snapdragon_High_Med_2016.
local
low complexity
qualcomm CWE-862
7.2
2019-02-11 CVE-2018-11855 Integer Overflow or Wraparound vulnerability in Qualcomm products
If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660.
local
low complexity
qualcomm CWE-190
7.2
2019-02-11 CVE-2018-11847 Improper Input Validation vulnerability in Qualcomm products
Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables and Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439 and Snapdragon_High_Med_2016
local
low complexity
qualcomm CWE-20
7.2
2019-01-18 CVE-2018-5881 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Improper validation of buffer length checks in the lwm2m device management protocol can leads to a buffer overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660
low complexity
qualcomm CWE-119
8.3
2019-01-18 CVE-2018-5880 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Improper data length check while processing an event report indication can lead to a buffer overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660
local
low complexity
qualcomm CWE-119
7.2
2019-01-18 CVE-2018-5879 Out-of-bounds Write vulnerability in Qualcomm products
Improper length check while processing an MQTT message can lead to heap overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660
low complexity
qualcomm CWE-787
8.3
2019-01-18 CVE-2018-5869 Improper Input Validation vulnerability in Qualcomm products
Improper input validation in the QTEE keymaster app can lead to invalid memory access in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 800, SD 810
local
low complexity
qualcomm CWE-20
7.2
2019-01-18 CVE-2018-5867 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130
local
low complexity
qualcomm CWE-119
7.2
2019-01-18 CVE-2018-11998 Race Condition vulnerability in Qualcomm products
While processing a packet decode request in MQTT, Race condition can occur leading to an out-of-bounds access in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 427, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016
7.9