Vulnerabilities > Qualcomm > Sc8380Xp Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-10-07 | CVE-2024-23369 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption when invalid length is provided from HLOS for FRS/UDS request/response buffers. | 7.8 |
| 2024-10-07 | CVE-2024-33065 | Unspecified vulnerability in Qualcomm products Memory corruption while taking snapshot when an offset variable is set by camera driver. | 7.8 |
| 2024-09-02 | CVE-2024-33047 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption when the captureRead QDCM command is invoked from user-space. | 7.8 |
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2024-08-05 | CVE-2024-23355 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when keymaster operation imports a shared key. | 7.8 |
| 2024-07-01 | CVE-2023-43554 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing IOCTL handler in FastRPC. | 7.8 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-06-03 | CVE-2023-43538 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization. | 7.8 |