Vulnerabilities > Qualcomm > Sc8180X AD Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2025-02-03 | CVE-2024-38420 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while configuring a Hypervisor based input virtual device. | 7.8 |
2025-02-03 | CVE-2024-45560 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption while taking a snapshot with hardware encoder due to unvalidated userspace buffer. | 7.0 |
2025-02-03 | CVE-2024-45561 | Use After Free vulnerability in Qualcomm products Memory corruption while handling IOCTL call from user-space to set latency level. | 7.8 |
2025-01-06 | CVE-2024-45541 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption when IOCTL call is invoked from user-space to read board data. | 7.8 |
2025-01-06 | CVE-2024-45542 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver. | 7.8 |
2024-07-01 | CVE-2023-43554 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing IOCTL handler in FastRPC. | 7.8 |
2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |