Vulnerabilities > Qualcomm > Sa9000P Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-10-03 | CVE-2023-33039 | Use After Free vulnerability in Qualcomm products Memory corruption in Automotive Display while destroying the image handle created using connected display driver. | 7.8 |
2023-09-05 | CVE-2023-21662 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core Platform while printing the response buffer in log. | 7.8 |
2023-09-05 | CVE-2023-21664 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core Platform while printing the response buffer in log. | 7.8 |
2023-08-08 | CVE-2023-21626 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key. | 7.1 |
2023-08-08 | CVE-2023-21643 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to untrusted pointer dereference in automotive during system call. | 7.8 |
2023-08-08 | CVE-2023-21651 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE. | 7.8 |
2023-08-08 | CVE-2023-21652 | Use of Hard-coded Credentials vulnerability in Qualcomm products Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use. | 7.1 |
2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
2023-06-06 | CVE-2022-33307 | Double Free vulnerability in Qualcomm products Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed. | 7.8 |
2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |