Vulnerabilities > Qualcomm > Sa8775P Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2025-01-06 | CVE-2024-45553 | Use After Free vulnerability in Qualcomm products Memory corruption can occur when process-specific maps are added to the global list. | 7.8 |
2025-01-06 | CVE-2024-45555 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption can occur if an already verified IFS2 image is overwritten, bypassing boot verification. | 7.8 |
2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |
2024-12-02 | CVE-2024-33044 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption while Configuring the SMR/S2CR register in Bypass mode. | 7.8 |
2024-12-02 | CVE-2024-33056 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption when allocating and accessing an entry in an SMEM partition continuously. | 7.8 |
2024-12-02 | CVE-2024-33063 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS while parsing the ML IE when a beacon with common info length of the ML IE greater than the ML IE inside which this element is present. | 7.5 |
2024-11-04 | CVE-2024-38419 | Use After Free vulnerability in Qualcomm products Memory corruption while invoking IOCTL calls from the use-space for HGSL memory node. | 7.8 |
2024-11-04 | CVE-2024-38421 | Use After Free vulnerability in Qualcomm products Memory corruption while processing GPU commands. | 7.8 |
2024-11-04 | CVE-2024-38422 | Unspecified vulnerability in Qualcomm products Memory corruption while processing voice packet with arbitrary data received from ADSP. | 7.8 |
2024-11-04 | CVE-2024-38424 | Use After Free vulnerability in Qualcomm products Memory corruption during GNSS HAL process initialization. | 7.8 |