Vulnerabilities > Qualcomm > Sa8770P Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-11-04 | CVE-2024-33068 | Use After Free vulnerability in Qualcomm products Transient DOS while parsing fragments of MBSSID IE from beacon frame. | 6.5 |
| 2024-11-04 | CVE-2024-38405 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing the CU information from RNR IE. | 6.5 |
| 2024-10-07 | CVE-2024-23378 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking IOCTL calls for MSM module from the user space during audio playback and record. | 6.7 |
| 2024-10-07 | CVE-2024-23379 | Double Free vulnerability in Qualcomm products Memory corruption while unmapping the fastrpc map when two threads can free the same map in concurrent scenario. | 6.7 |
| 2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
| 2024-02-06 | CVE-2023-33064 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Audio when invoking callback function of ASM driver. | 5.5 |
| 2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
| 2023-12-05 | CVE-2023-33070 | Improper Authentication vulnerability in Qualcomm products Transient DOS in Automotive OS due to improper authentication to the secure IO calls. | 5.5 |