Vulnerabilities > Qualcomm > Sa8770P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-12-05 | CVE-2023-22668 | Use After Free vulnerability in Qualcomm products Memory Corruption in Audio while invoking IOCTLs calls from the user-space. | 7.8 |
| 2023-12-05 | CVE-2023-28546 | Classic Buffer Overflow vulnerability in Qualcomm products Memory Corruption in SPS Application while exporting public key in sorter TA. | 7.8 |
| 2023-12-05 | CVE-2023-28550 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in MPP performance while accessing DSM watermark using external memory address. | 7.8 |
| 2023-12-05 | CVE-2023-28585 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while loading an ELF segment in TEE Kernel. | 8.8 |
| 2023-12-05 | CVE-2023-28587 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level. | 7.8 |
| 2023-12-05 | CVE-2023-33017 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Boot while running a ListVars test in UEFI Menu during boot. | 7.8 |
| 2023-12-05 | CVE-2023-33022 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in HLOS while invoking IOCTL calls from user-space. | 7.8 |
| 2023-12-05 | CVE-2023-33053 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in Kernel while parsing metadata. | 7.8 |
| 2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
| 2023-12-05 | CVE-2023-33079 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Audio while running invalid audio recording from ADSP. | 7.8 |