Vulnerabilities > Qualcomm > Sa8650P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-08-05 | CVE-2024-33028 | Use After Free vulnerability in Qualcomm products Memory corruption as fence object may still be accessed in timeline destruct after isync fence is released. | 7.8 |
| 2024-08-05 | CVE-2024-33034 | Use After Free vulnerability in Qualcomm products Memory corruption can occur if VBOs hold outdated or invalid GPU SMMU mappings, especially when the binding and reclaiming of memory buffers are performed at the same time. | 7.8 |
| 2024-07-01 | CVE-2024-21456 | Out-of-bounds Read vulnerability in Qualcomm products Information Disclosure while parsing beacon frame in STA. | 9.1 |
| 2024-07-01 | CVE-2024-21457 | Out-of-bounds Read vulnerability in Qualcomm products INformation disclosure while handling Multi-link IE in beacon frame. | 7.5 |
| 2024-07-01 | CVE-2024-21458 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling SA query action frame. | 7.5 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21466 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Information disclosure while parsing sub-IE length during new IE generation. | 7.5 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |