Vulnerabilities > Qualcomm > Sa8255P Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-11-04 | CVE-2024-33068 | Use After Free vulnerability in Qualcomm products Transient DOS while parsing fragments of MBSSID IE from beacon frame. | 6.5 |
| 2024-11-04 | CVE-2024-38403 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing BTM ML IE when per STA profile is not included. | 6.5 |
| 2024-11-04 | CVE-2024-38405 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing the CU information from RNR IE. | 6.5 |
| 2024-10-07 | CVE-2024-23378 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking IOCTL calls for MSM module from the user space during audio playback and record. | 6.7 |
| 2024-10-07 | CVE-2024-23379 | Double Free vulnerability in Qualcomm products Memory corruption while unmapping the fastrpc map when two threads can free the same map in concurrent scenario. | 6.7 |
| 2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
| 2024-02-06 | CVE-2023-33064 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Audio when invoking callback function of ASM driver. | 5.5 |
| 2024-01-02 | CVE-2023-33014 | Improper Input Validation vulnerability in Qualcomm products Information disclosure in Core services while processing a Diag command. | 6.8 |
| 2024-01-02 | CVE-2023-33036 | NULL Pointer Dereference vulnerability in Qualcomm products Permanent DOS in Hypervisor while untrusted VM without PSCI support makes a PSCI call. | 5.5 |
| 2024-01-02 | CVE-2023-33037 | Missing Encryption of Sensitive Data vulnerability in Qualcomm products Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. | 5.5 |