Vulnerabilities > Qualcomm > Sa8255P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-07-01 | CVE-2024-21466 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Information disclosure while parsing sub-IE length during new IE generation. | 7.5 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-07-01 | CVE-2024-23372 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size. | 7.8 |
| 2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
| 2024-07-01 | CVE-2024-23380 | Use After Free vulnerability in Qualcomm products Memory corruption while handling user packets during VBO bind operation. | 7.8 |
| 2024-04-01 | CVE-2023-28547 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in SPS Application while requesting for public key in sorter TA. | 7.8 |
| 2024-04-01 | CVE-2023-33023 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing finish_sign command to pass a rsp buffer. | 7.8 |
| 2024-03-04 | CVE-2023-28578 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core Services while executing the command for removing a single event listener. | 7.8 |
| 2024-03-04 | CVE-2023-43546 | Use After Free vulnerability in Qualcomm products Memory corruption while invoking HGSL IOCTL context create. | 7.8 |
| 2024-03-04 | CVE-2023-43547 | Use After Free vulnerability in Qualcomm products Memory corruption while invoking IOCTLs calls in Automotive Multimedia. | 7.8 |