Vulnerabilities > Qualcomm > Sa8195P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |
| 2023-11-07 | CVE-2023-33074 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio when SSR event is triggered after music playback is stopped. | 7.8 |
| 2023-10-03 | CVE-2023-22382 | Unspecified vulnerability in Qualcomm products Weak configuration in Automotive while VM is processing a listener request from TEE. | 8.2 |
| 2023-10-03 | CVE-2023-22384 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in VR Service while sending data using Fast Message Queue (FMQ). | 7.8 |
| 2023-10-03 | CVE-2023-24847 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in Modem while allocating DSM items. | 7.5 |
| 2023-10-03 | CVE-2023-24850 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application. | 7.8 |
| 2023-10-03 | CVE-2023-24853 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in HLOS while registering for key provisioning notify. | 7.8 |
| 2023-10-03 | CVE-2023-28539 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN Host when the firmware invokes multiple WMI Service Available command. | 7.8 |
| 2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
| 2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |