Vulnerabilities > Qualcomm > Sa8155 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-12-05 | CVE-2023-33098 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing WPA IES, when it is passed with length more than expected size. | 7.5 |
2023-12-05 | CVE-2023-33107 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call. | 7.8 |
2023-11-07 | CVE-2023-24852 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core due to secure memory access by user while loading modem image. | 7.8 |
2023-11-07 | CVE-2023-28545 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in TZ Secure OS while loading an app ELF. | 7.8 |
2023-11-07 | CVE-2023-28556 | Unspecified vulnerability in Qualcomm products Cryptographic issue in HLOS during key management. | 7.8 |
2023-11-07 | CVE-2023-28563 | Unspecified vulnerability in Qualcomm products Information disclosure in IOE Firmware while handling WMI command. | 5.5 |
2023-11-07 | CVE-2023-28566 | Unspecified vulnerability in Qualcomm products Information disclosure in WLAN HAL while handling the WMI state info command. | 5.5 |
2023-11-07 | CVE-2023-28569 | Unspecified vulnerability in Qualcomm products Information disclosure in WLAN HAL while handling command through WMI interfaces. | 5.5 |
2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |
2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |