Vulnerabilities > Qualcomm > Sa6155P Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-10-07 | CVE-2024-23374 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption is possible when an attempt is made from userspace or console to write some haptics effects pattern to the haptics debugfs file. | 6.7 |
| 2024-10-07 | CVE-2024-23375 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption during the network scan request. | 6.7 |
| 2024-10-07 | CVE-2024-23376 | Use After Free vulnerability in Qualcomm products Memory corruption while sending the persist buffer command packet from the user-space to the kernel space through the IOCTL call. | 6.7 |
| 2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
| 2024-02-06 | CVE-2023-33064 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Audio when invoking callback function of ASM driver. | 5.5 |
| 2024-01-02 | CVE-2023-33036 | NULL Pointer Dereference vulnerability in Qualcomm products Permanent DOS in Hypervisor while untrusted VM without PSCI support makes a PSCI call. | 5.5 |
| 2024-01-02 | CVE-2023-33037 | Missing Encryption of Sensitive Data vulnerability in Qualcomm products Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. | 5.5 |
| 2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
| 2023-12-05 | CVE-2023-33070 | Improper Authentication vulnerability in Qualcomm products Transient DOS in Automotive OS due to improper authentication to the secure IO calls. | 5.5 |
| 2023-11-07 | CVE-2023-28553 | Unspecified vulnerability in Qualcomm products Information Disclosure in WLAN Host when processing WMI event command. | 5.5 |