Vulnerabilities > Qualcomm > Sa6155 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-08-05 | CVE-2024-33027 | Unspecified vulnerability in Qualcomm products Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table. | 7.8 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-06-03 | CVE-2023-43538 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization. | 7.8 |
| 2024-05-06 | CVE-2023-33119 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption while loading a VM from a signed VM image that is not coherent in the processor cache. | 7.0 |
| 2024-05-06 | CVE-2023-43530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in HLOS while checking for the storage type. | 7.8 |
| 2024-04-01 | CVE-2023-28547 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in SPS Application while requesting for public key in sorter TA. | 7.8 |
| 2024-04-01 | CVE-2023-33023 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing finish_sign command to pass a rsp buffer. | 7.8 |
| 2024-04-01 | CVE-2024-21468 | Use After Free vulnerability in Qualcomm products Memory corruption when there is failed unmap operation in GPU. | 7.8 |