Vulnerabilities > Qualcomm > Sa6150P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-04-01 | CVE-2021-35106 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to improper length calculation of WMI message. | 7.2 |
| 2022-04-01 | CVE-2021-35115 | Use After Free vulnerability in Qualcomm products Improper handling of multiple session supported by PVM backend can lead to use after free in Snapdragon Auto, Snapdragon Mobile | 4.6 |
| 2022-04-01 | CVE-2021-35117 | Out-of-bounds Read vulnerability in Qualcomm products An Out of Bounds read may potentially occur while processing an IBSS beacon, in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 9.4 |
| 2022-02-11 | CVE-2021-30317 | Improper Authentication vulnerability in Qualcomm products Improper validation of program headers containing ELF metadata can lead to image verification bypass in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2022-02-11 | CVE-2021-30318 | Classic Buffer Overflow vulnerability in Qualcomm products Improper validation of input when provisioning the HDCP key can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
| 2022-02-11 | CVE-2021-30323 | Classic Buffer Overflow vulnerability in Qualcomm products Improper validation of maximum size of data write to EFS file can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2022-02-11 | CVE-2021-30324 | Classic Buffer Overflow vulnerability in Qualcomm products Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2022-02-11 | CVE-2021-30325 | Improper Validation of Array Index vulnerability in Qualcomm products Possible out of bound access of DCI resources due to lack of validation process and resource allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2022-02-11 | CVE-2021-35068 | NULL Pointer Dereference vulnerability in Qualcomm products Lack of null check while freeing the device information buffer in the Bluetooth HFP protocol can lead to a NULL pointer dereference in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-02-11 | CVE-2021-35069 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper validation of data length received from DMA buffer can lead to memory corruption. | 7.2 |