Vulnerabilities > Qualcomm > Robotics RB5 Platform Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-12-05 | CVE-2023-33107 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call. | 7.8 |
| 2023-11-07 | CVE-2023-24852 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core due to secure memory access by user while loading modem image. | 7.8 |
| 2023-11-07 | CVE-2023-28545 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in TZ Secure OS while loading an app ELF. | 7.8 |
| 2023-11-07 | CVE-2023-28556 | Unspecified vulnerability in Qualcomm products Cryptographic issue in HLOS during key management. | 7.8 |
| 2023-10-03 | CVE-2023-21673 | Unspecified vulnerability in Qualcomm products Improper Access to the VM resource manager can lead to Memory Corruption. | 7.8 |
| 2023-10-03 | CVE-2023-28539 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN Host when the firmware invokes multiple WMI Service Available command. | 7.8 |
| 2023-10-03 | CVE-2023-33026 | Resource Exhaustion vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a NAN management frame. | 7.5 |
| 2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
| 2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |
| 2023-10-03 | CVE-2023-33034 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while parsing the ADSP response command. | 7.8 |