Vulnerabilities > Qualcomm > Medium
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2019-01-18 | CVE-2017-8276 | Incorrect Authorization vulnerability in Qualcomm products Improper authorization involving a fuse in TrustZone in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | 4.6 |
2018-11-28 | CVE-2018-5918 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Possible buffer overflow in DRM Trusted application due to lack of check function return values in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDA845, SDX24, SXR1130. | 4.6 |
2018-11-28 | CVE-2018-5916 | Out-of-bounds Read vulnerability in Qualcomm products Buffer overread while decoding PDP modify request or network initiated secondary PDP activation in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDA845, SDX20, SXR1130. | 6.1 |
2018-10-26 | CVE-2018-11951 | Incorrect Permission Assignment for Critical Resource vulnerability in Qualcomm SD 845 Firmware and SD 850 Firmware Improper access control in core module lead XBL_LOADER performs the ZI region clear for QTEE instead of XBL_SEC in Snapdragon Mobile in version SD 845, SD 850. | 4.9 |
2018-10-26 | CVE-2018-11846 | Information Exposure vulnerability in Qualcomm products The use of a non-time-constant memory comparison operation can lead to timing/side channel attacks in Snapdragon Mobile in version SD 210/SD 212/SD 205, SD 845, SD 850 | 4.7 |
2018-10-26 | CVE-2017-18309 | Improper Validation of Array Index vulnerability in Qualcomm SD 845 Firmware and SD 850 Firmware A micro-core of QMP transportation may cause a macro-core to read from or write to arbitrary memory in Snapdragon Mobile in version SD 845, SD 850. | 6.6 |
2018-10-23 | CVE-2017-18313 | Unspecified vulnerability in Qualcomm products Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617. | 5.7 |
2018-10-23 | CVE-2017-18305 | Unspecified vulnerability in Qualcomm products XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835. local qualcomm | 6.9 |
2018-10-23 | CVE-2017-18300 | Information Exposure vulnerability in Qualcomm products Secure display content could be accessed by third party trusted application after creating a fault in other trusted applications in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SDA660. | 4.9 |
2018-10-23 | CVE-2017-18299 | Resource Exhaustion vulnerability in Qualcomm products Improper translation table consolidation logic leads to resource exhaustion and QSEE error in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660 | 4.9 |