Vulnerabilities > Qualcomm > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-02-11 | CVE-2018-11855 | Integer Overflow or Wraparound vulnerability in Qualcomm products If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660. | 7.2 |
| 2019-02-11 | CVE-2018-11847 | Improper Input Validation vulnerability in Qualcomm products Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables and Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439 and Snapdragon_High_Med_2016 | 7.2 |
| 2019-01-18 | CVE-2018-5881 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Improper validation of buffer length checks in the lwm2m device management protocol can leads to a buffer overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660 | 8.3 |
| 2019-01-18 | CVE-2018-5880 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Improper data length check while processing an event report indication can lead to a buffer overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660 | 7.2 |
| 2019-01-18 | CVE-2018-5879 | Out-of-bounds Write vulnerability in Qualcomm products Improper length check while processing an MQTT message can lead to heap overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660 | 8.3 |
| 2019-01-18 | CVE-2018-5869 | Improper Input Validation vulnerability in Qualcomm products Improper input validation in the QTEE keymaster app can lead to invalid memory access in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 800, SD 810 | 7.2 |
| 2019-01-18 | CVE-2018-5868 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 425, SD 430, SD 450, SD 625, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX24, SXR1130 | 7.2 |
| 2019-01-18 | CVE-2018-5867 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130 | 7.2 |
| 2019-01-18 | CVE-2018-11998 | Race Condition vulnerability in Qualcomm products While processing a packet decode request in MQTT, Race condition can occur leading to an out-of-bounds access in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 427, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016 | 7.9 |
| 2019-01-18 | CVE-2018-11993 | Out-of-bounds Write vulnerability in Qualcomm Mdm9206 Firmware and Mdm9607 Firmware Improper check while accessing the local memory stack on MQTT connection request can lead to buffer overflow in snapdragon wear in versions MDM9206, MDM9607 | 8.3 |