Vulnerabilities > Qualcomm > High

DATE CVE VULNERABILITY TITLE RISK
2023-01-09 CVE-2022-33290 NULL Pointer Dereference vulnerability in Qualcomm products
Transient DOS in Bluetooth HOST due to null pointer dereference when a mismatched argument is passed.
network
low complexity
qualcomm CWE-476
7.5
2023-01-09 CVE-2022-33299 NULL Pointer Dereference vulnerability in Qualcomm products
Transient DOS due to null pointer dereference in Bluetooth HOST while receiving an attribute protocol PDU with zero length data.
network
low complexity
qualcomm CWE-476
7.5
2023-01-09 CVE-2022-33300 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Automotive Android OS due to improper input validation.
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40516 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Core due to stack-based buffer overflow.
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40517 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in core due to stack-based buffer overflow
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40520 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to stack-based buffer overflow in Core
local
low complexity
qualcomm CWE-787
7.8
2022-12-15 CVE-2022-22063 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Core due to improper configuration in boot remapper.
local
low complexity
qualcomm CWE-787
7.8
2022-12-13 CVE-2022-25672 Reachable Assertion vulnerability in Qualcomm products
Denial of service in MODEM due to reachable assertion while processing SIB1 with invalid Bandwidth in Snapdragon Mobile
network
low complexity
qualcomm CWE-617
7.5
2022-12-13 CVE-2022-25673 Reachable Assertion vulnerability in Qualcomm products
Denial of service in MODEM due to reachable assertion while processing configuration from network in Snapdragon Mobile
network
low complexity
qualcomm CWE-617
7.5
2022-12-13 CVE-2022-25677 Use After Free vulnerability in Qualcomm products
Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
7.8