Vulnerabilities > Qualcomm > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-11-07 | CVE-2023-28570 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing audio effects. | 7.8 |
| 2023-11-07 | CVE-2023-28572 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HOST while processing the WLAN scan descriptor list. | 8.8 |
| 2023-11-07 | CVE-2023-28574 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in core services when Diag handler receives a command to configure event listeners. | 7.8 |
| 2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |
| 2023-11-07 | CVE-2023-33047 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing no-inherit IES. | 7.5 |
| 2023-11-07 | CVE-2023-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing t2lm buffers. | 7.5 |
| 2023-11-07 | CVE-2023-33055 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while invoking callback function in driver from ADSP. | 7.8 |
| 2023-11-07 | CVE-2023-33056 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in WLAN Firmware when firmware receives beacon including T2LM IE. | 7.5 |
| 2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |
| 2023-11-07 | CVE-2023-33061 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing WLAN beacon or probe-response frame. | 7.5 |