Vulnerabilities > Qualcomm > Qualcomm Video Collaboration VC3 Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
| 2023-12-05 | CVE-2023-28587 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level. | 7.8 |
| 2023-12-05 | CVE-2023-28588 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS in Bluetooth Host while rfc slot allocation. | 7.5 |
| 2023-12-05 | CVE-2023-33017 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Boot while running a ListVars test in UEFI Menu during boot. | 7.8 |
| 2023-12-05 | CVE-2023-33018 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while using the UIM diag command to get the operators name. | 7.8 |
| 2023-12-05 | CVE-2023-33022 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in HLOS while invoking IOCTL calls from user-space. | 7.8 |
| 2023-12-05 | CVE-2023-33042 | Improper Input Validation vulnerability in Qualcomm products Transient DOS in Modem after RRC Setup message is received. | 7.5 |
| 2023-12-05 | CVE-2023-33043 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Modem when a Beam switch request is made with a non-configured BWP. | 7.5 |
| 2023-12-05 | CVE-2023-33044 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Data modem while handling TLB control messages from the Network. | 7.5 |
| 2023-12-05 | CVE-2023-33053 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in Kernel while parsing metadata. | 7.8 |