Vulnerabilities > Qualcomm > Qualcomm Video Collaboration VC3 Platform Firmware

DATE CVE VULNERABILITY TITLE RISK
2024-02-06 CVE-2023-33065 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure in Audio while accessing AVCS services from ADSP payload.
local
low complexity
qualcomm CWE-125
7.1
2024-01-02 CVE-2023-33062 Unspecified vulnerability in Qualcomm products
Transient DOS in WLAN Firmware while parsing a BTM request.
network
low complexity
qualcomm
7.5
2024-01-02 CVE-2023-33085 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in wearables while processing data from AON.
local
low complexity
qualcomm CWE-120
7.8
2024-01-02 CVE-2023-33094 Use After Free vulnerability in Qualcomm products
Memory corruption while running VK synchronization with KASAN enabled.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33109 NULL Pointer Dereference vulnerability in Qualcomm products
Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host.
network
low complexity
qualcomm CWE-476
7.5
2024-01-02 CVE-2023-33112 Unspecified vulnerability in Qualcomm products
Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element.
network
low complexity
qualcomm
7.5
2024-01-02 CVE-2023-33113 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption when resource manager sends the host kernel a reply message with multiple fragments.
local
low complexity
qualcomm CWE-787
7.8
2024-01-02 CVE-2023-33114 Use After Free vulnerability in Qualcomm products
Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33117 Use After Free vulnerability in Qualcomm products
Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command.
local
low complexity
qualcomm CWE-416
7.8
2024-01-02 CVE-2023-33118 Use After Free vulnerability in Qualcomm products
Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL.
local
low complexity
qualcomm CWE-416
7.8