Vulnerabilities > Qualcomm > Qtc410S Firmware > Medium

DATE CVE VULNERABILITY TITLE RISK
2021-06-09 CVE-2020-11160 Integer Overflow or Wraparound vulnerability in Qualcomm products
Resource leakage issue during dci client registration due to reference count is not decremented if dci client registration fails in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-190
6.7
2021-05-07 CVE-2020-11293 Out-of-bounds Read vulnerability in Qualcomm products
Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-125
6.0
2021-05-07 CVE-2021-1906 Improper Handling of Exceptional Conditions vulnerability in Qualcomm products
Improper handling of address deregistration on failure can lead to new GPU address allocation failure.
local
low complexity
qualcomm CWE-755
5.5
2021-04-07 CVE-2020-11252 Out-of-bounds Read vulnerability in Qualcomm products
Trustzone initialization code will disable xPU`s when memory dumps are enabled and lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-125
5.5
2021-03-17 CVE-2020-11308 Improper Validation of Array Index vulnerability in Qualcomm products
Buffer overflow occurs when trying to convert ASCII string to Unicode string if the actual size is more than required in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
low complexity
qualcomm CWE-129
6.8
2021-03-17 CVE-2020-11221 Information Exposure vulnerability in Qualcomm products
Usage of syscall by non-secure entity can allow extraction of secure QTEE diagnostic information in clear text form due to insufficient checks in the syscall handler and leads to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-200
5.5
2021-03-17 CVE-2020-11220 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
While processing storage SCM commands there is a time of check or time of use window where a pointer used could be invalid at a specific time while executing the storage SCM call in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
local
high complexity
qualcomm CWE-367
6.4
2021-03-17 CVE-2020-11199 Information Exposure vulnerability in Qualcomm products
HLOS to access EL3 stack canary by just mapping imem region due to Improper access control and can lead to information exposure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-200
5.5
2021-02-22 CVE-2020-3664 Out-of-bounds Read vulnerability in Qualcomm products
Out of bound read access in hypervisor due to an invalid read access attempt by passing invalid addresses in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-125
6.0
2021-02-22 CVE-2020-11198 Improper Cross-boundary Removal of Sensitive Data vulnerability in Qualcomm products
Key material used for TZ diag buffer encryption and other data related to log buffer is not wiped securely due to improper usage of memset in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-212
6.7