Vulnerabilities > Qualcomm > Qsm8350 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2023-21658 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing the received beacon or probe response frame. | 7.5 |
| 2023-06-06 | CVE-2023-21659 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing frames with missing header fields. | 7.5 |
| 2023-06-06 | CVE-2023-21670 | Incorrect Authorization vulnerability in Qualcomm products Memory Corruption in GPU Subsystem due to arbitrary command execution from GPU in privileged mode. | 7.8 |
| 2023-05-02 | CVE-2022-25713 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Automotive due to Improper Restriction of Operations within the Bounds of a Memory Buffer while exporting a shared key. | 7.8 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
| 2023-04-13 | CVE-2022-33269 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment. | 7.8 |
| 2023-04-13 | CVE-2022-33288 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information. | 8.8 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |
| 2023-03-10 | CVE-2022-33242 | Improper Authentication vulnerability in Qualcomm products Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD. | 7.8 |
| 2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |