Vulnerabilities > Qualcomm > Qsm8350 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-08-05 | CVE-2024-33023 | Use After Free vulnerability in Qualcomm products Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events. | 7.8 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
| 2024-06-03 | CVE-2023-43538 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization. | 7.8 |
| 2024-06-03 | CVE-2023-43556 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Hypervisor when platform information mentioned is not aligned. | 8.8 |
| 2024-05-06 | CVE-2023-33119 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption while loading a VM from a signed VM image that is not coherent in the processor cache. | 7.0 |
| 2024-05-06 | CVE-2023-43530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in HLOS while checking for the storage type. | 7.8 |
| 2024-05-06 | CVE-2023-43531 | Access of Uninitialized Pointer vulnerability in Qualcomm products Memory corruption while verifying the serialized header when the key pairs are generated. | 7.8 |