Vulnerabilities > Qualcomm > Qsm8350 Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-06-06 CVE-2023-21670 Incorrect Authorization vulnerability in Qualcomm products
Memory Corruption in GPU Subsystem due to arbitrary command execution from GPU in privileged mode.
local
low complexity
qualcomm CWE-863
7.8
2023-05-02 CVE-2022-33273 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer over-read in Trusted Execution Environment while QRKS report generation.
local
low complexity
qualcomm CWE-125
5.5
2023-05-02 CVE-2022-25713 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Memory corruption in Automotive due to Improper Restriction of Operations within the Bounds of a Memory Buffer while exporting a shared key.
local
low complexity
qualcomm CWE-119
7.8
2023-04-13 CVE-2022-33231 Double Free vulnerability in Qualcomm products
Memory corruption due to double free in core while initializing the encryption key.
local
low complexity
qualcomm CWE-415
7.8
2023-04-13 CVE-2022-33269 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment.
local
low complexity
qualcomm CWE-190
7.8
2023-04-13 CVE-2022-33288 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information.
local
low complexity
qualcomm CWE-120
8.8
2023-04-13 CVE-2022-40532 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.
local
low complexity
qualcomm CWE-190
7.8
2023-03-10 CVE-2022-33242 Improper Authentication vulnerability in Qualcomm products
Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD.
local
low complexity
qualcomm CWE-287
7.8
2023-03-10 CVE-2022-33257 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone.
local
high complexity
qualcomm CWE-367
7.0
2023-03-10 CVE-2022-33278 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity.
local
low complexity
qualcomm CWE-120
7.8