Vulnerabilities > Qualcomm > Qsm8350 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-09-02 | CVE-2021-35132 | Improper Validation of Specified Quantity in Input vulnerability in Qualcomm products Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-09-02 | CVE-2021-35134 | Incorrect Calculation of Buffer Size vulnerability in Qualcomm products Due to insufficient validation of ELF headers, an Incorrect Calculation of Buffer Size can occur in Boot leading to memory corruption in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 8.4 |
| 2022-09-02 | CVE-2021-35135 | NULL Pointer Dereference vulnerability in Qualcomm products A null pointer dereference may potentially occur during RSA key import in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.5 |
| 2022-09-02 | CVE-2022-22062 | Out-of-bounds Read vulnerability in Qualcomm products An out-of-bounds read can occur while parsing a server certificate due to improper length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 9.1 |
| 2022-09-02 | CVE-2022-22069 | Cleartext Storage of Sensitive Information vulnerability in Qualcomm products Devices with keyprotect off may store unencrypted keybox in RPMB and cause cryptographic issue in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2021-35090 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Possible hypervisor memory corruption due to TOC TOU race condition when updating address mappings in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-06-14 | CVE-2021-35094 | Improper Authentication vulnerability in Qualcomm products Improper verification of timeout-based authentication in identity credential can lead to invalid authorization in HLOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2021-11-12 | CVE-2021-1903 | Incorrect Authorization vulnerability in Qualcomm products Possible denial of service scenario can occur due to lack of length check on Channel Switch Announcement IE in beacon or probe response frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.3 |
| 2021-11-12 | CVE-2021-1921 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Possible memory corruption due to Improper handling of hypervisor unmap operations for concurrent memory operations in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.0 |
| 2021-11-12 | CVE-2021-1924 | Information Exposure Through Discrepancy vulnerability in Qualcomm products Information disclosure through timing and power side-channels during mod exponentiation for RSA-CRT in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |