Vulnerabilities > Qualcomm > Qsm8250 Firmware > Medium

DATE CVE VULNERABILITY TITLE RISK
2023-01-09 CVE-2022-33285 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS due to buffer over-read in WLAN while parsing WLAN CSA action frames.
low complexity
qualcomm CWE-125
6.5
2023-01-09 CVE-2022-33286 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames.
low complexity
qualcomm CWE-125
6.5
2023-01-09 CVE-2022-40518 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer overread in Core
local
low complexity
qualcomm CWE-125
5.5
2023-01-09 CVE-2022-40519 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer overread in Core
local
low complexity
qualcomm CWE-125
5.5
2022-10-19 CVE-2022-25664 Incomplete Cleanup vulnerability in Qualcomm products
Information disclosure due to exposure of information while GPU reads the data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-459
5.5
2022-10-19 CVE-2022-25666 Use After Free vulnerability in Qualcomm products
Memory corruption due to use after free in service while trying to access maps by different threads in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
6.7
2022-06-14 CVE-2021-30349 Unspecified vulnerability in Qualcomm products
Improper access control sequence for AC database after memory allocation can lead to possible memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm
6.7
2022-01-13 CVE-2021-30313 Use After Free vulnerability in Qualcomm products
Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
high complexity
qualcomm CWE-416
6.4
2022-01-03 CVE-2021-30278 Improper Input Validation vulnerability in Qualcomm products
Improper input validation in TrustZone memory transfer interface can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-20
5.5
2021-11-12 CVE-2021-1924 Information Exposure Through Discrepancy vulnerability in Qualcomm products
Information disclosure through timing and power side-channels during mod exponentiation for RSA-CRT in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-203
5.5