Vulnerabilities > Qualcomm > Qsm8250 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2021-06-09 | CVE-2020-11306 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow in RPMB counter due to lack of length check on user provided data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |
2021-06-09 | CVE-2020-11161 | Out-of-bounds Read vulnerability in Qualcomm products Out-of-bounds memory access can occur while calculating alignment requirements for a negative width from external components in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.1 |
2021-06-09 | CVE-2020-11165 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to buffer overflow while copying the message provided by HLOS into buffer without validating the length of buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |
2021-06-09 | CVE-2020-11178 | Improper Input Validation vulnerability in Qualcomm products Trusted APPS to overwrite the CPZ memory of another use-case as TZ only checks the physical address not overlapping with its memory and its RoT memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
2021-06-09 | CVE-2020-11182 | Out-of-bounds Write vulnerability in Qualcomm products Possible heap overflow while parsing NAL header due to lack of check of length of data received from user in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 9.8 |
2021-06-09 | CVE-2020-11239 | Use After Free vulnerability in Qualcomm products Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2021-06-09 | CVE-2020-11240 | Incorrect Calculation of Buffer Size vulnerability in Qualcomm products Memory corruption due to ioctl command size was incorrectly set to the size of a pointer and not enough storage is allocated for the copy of the user argument in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2021-06-09 | CVE-2020-11250 | Use After Free vulnerability in Qualcomm products Use after free due to race condition when reopening the device driver repeatedly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.0 |
2021-06-09 | CVE-2020-11261 | Improper Input Validation vulnerability in Qualcomm products Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2021-06-09 | CVE-2020-11262 | Use After Free vulnerability in Qualcomm products A race between command submission and destroying the context can cause an invalid context being added to the list leads to use after free issue. | 7.0 |