Vulnerabilities > Qualcomm > Qrb5165N Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-07-01 | CVE-2024-23372 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size. | 7.8 |
2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
2024-07-01 | CVE-2024-23380 | Use After Free vulnerability in Qualcomm products Memory corruption while handling user packets during VBO bind operation. | 7.8 |
2024-06-03 | CVE-2023-43537 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling T2LM Action Frame in WLAN Host. | 7.5 |
2024-06-03 | CVE-2023-43556 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Hypervisor when platform information mentioned is not aligned. | 8.8 |
2024-05-06 | CVE-2024-21471 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap of a GPU buffer fails in Linux. | 7.8 |
2024-05-06 | CVE-2024-23351 | Unspecified vulnerability in Qualcomm products Memory corruption as GPU registers beyond the last protected range can be accessed through LPAC submissions. | 7.8 |
2024-05-06 | CVE-2024-23354 | Use After Free vulnerability in Qualcomm products Memory corruption when the IOCTL call is interrupted by a signal. | 7.8 |
2024-04-01 | CVE-2023-28547 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in SPS Application while requesting for public key in sorter TA. | 7.8 |
2024-04-01 | CVE-2023-33023 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing finish_sign command to pass a rsp buffer. | 7.8 |