Vulnerabilities > Qualcomm > Qpa5460 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-05-07 | CVE-2020-11289 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Out of bound write can occur in TZ command handler due to lack of validation of command ID in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-05-07 | CVE-2020-11294 | Improper Validation of Array Index vulnerability in Qualcomm products Out of bound write in logger due to prefix size is not validated while prepended to logging string in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2021-05-07 | CVE-2021-1905 | Use After Free vulnerability in Qualcomm products Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. | 7.8 |
| 2021-05-07 | CVE-2021-1925 | Reachable Assertion vulnerability in Qualcomm products Possible denial of service scenario due to improper handling of group management action frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-05-07 | CVE-2021-1927 | Use After Free vulnerability in Qualcomm products Possible use after free due to lack of null check while memory is being freed in FastRPC driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-04-07 | CVE-2020-11255 | Memory Leak vulnerability in Qualcomm products Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2021-04-07 | CVE-2020-11245 | Integer Overflow or Wraparound vulnerability in Qualcomm products Unintended reads and writes by NS EL2 in access control driver due to lack of check of input validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-04-07 | CVE-2020-11242 | Unspecified vulnerability in Qualcomm products User could gain access to secure memory due to incorrect argument into address range validation api used in SDI to capture requested contents in Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2021-04-07 | CVE-2020-11234 | Use After Free vulnerability in Qualcomm products When sending a socket event message to a user application, invalid information will be passed if socket is freed by other thread resulting in a Use After Free condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-03-17 | CVE-2020-11309 | Use After Free vulnerability in Qualcomm products Use after free in GPU driver while mapping the user memory to GPU memory due to improper check of referenced memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |