Vulnerabilities > Qualcomm > Qcx315 Firmware

DATE CVE VULNERABILITY TITLE RISK
2021-09-08 CVE-2021-1920 Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
Integer underflow can occur due to improper handling of incoming RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-191
critical
10.0
2021-09-08 CVE-2021-1972 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow due to improper validation of device types during P2P search in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-120
critical
10.0