Vulnerabilities > Qualcomm > Qcs8155 Firmware > Medium
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
2023-12-05 | CVE-2023-33070 | Improper Authentication vulnerability in Qualcomm products Transient DOS in Automotive OS due to improper authentication to the secure IO calls. | 5.5 |
2023-11-07 | CVE-2023-28554 | Unspecified vulnerability in Qualcomm products Information Disclosure in Qualcomm IPC while reading values from shared memory in VM. | 5.5 |
2023-07-04 | CVE-2023-21624 | Unspecified vulnerability in Qualcomm products Information disclosure in DSP Services while loading dynamic module. | 5.5 |
2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
2023-03-10 | CVE-2022-22075 | Unspecified vulnerability in Qualcomm products Information Disclosure in Graphics during GPU context switch. | 5.5 |
2023-01-09 | CVE-2022-40518 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer overread in Core | 5.5 |
2023-01-09 | CVE-2022-40519 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer overread in Core | 5.5 |
2022-10-19 | CVE-2022-22078 | Integer Overflow or Wraparound vulnerability in Qualcomm products Denial of service in BOOT when partition size for a particular partition is requested due to integer overflow when blocks are calculated in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 4.6 |