Vulnerabilities > Qualcomm > Qcs6490 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-12-05 | CVE-2023-33106 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while submitting a large list of sync points in an AUX command to the IOCTL_KGSL_GPU_AUX_COMMAND. | 7.8 |
| 2023-12-05 | CVE-2023-33107 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call. | 7.8 |
| 2023-11-07 | CVE-2023-21671 | Unspecified vulnerability in Qualcomm products Memory Corruption in Core during syscall for Sectools Fuse comparison feature. | 7.8 |
| 2023-11-07 | CVE-2023-22388 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Multi-mode Call Processor while processing bit mask API. | 9.8 |
| 2023-11-07 | CVE-2023-24852 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core due to secure memory access by user while loading modem image. | 7.8 |
| 2023-11-07 | CVE-2023-28545 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in TZ Secure OS while loading an app ELF. | 7.8 |
| 2023-11-07 | CVE-2023-28556 | Unspecified vulnerability in Qualcomm products Cryptographic issue in HLOS during key management. | 7.8 |
| 2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |
| 2023-11-07 | CVE-2023-33047 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing no-inherit IES. | 7.5 |
| 2023-11-07 | CVE-2023-33055 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while invoking callback function in driver from ADSP. | 7.8 |