Vulnerabilities > Qualcomm > Qcs6490 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2025-02-03 | CVE-2024-49838 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the OCI IE with invalid length. | 7.5 |
2025-02-03 | CVE-2024-49839 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption during management frame processing due to mismatch in T2LM info element. | 9.8 |
2025-01-06 | CVE-2024-33041 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when input parameter validation for number of fences is missing for fence frame IOCTL calls, | 7.8 |
2025-01-06 | CVE-2024-33055 | Use After Free vulnerability in Qualcomm products Memory corruption while invoking IOCTL calls to unmap the DMA buffers. | 7.8 |
2025-01-06 | CVE-2024-45541 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption when IOCTL call is invoked from user-space to read board data. | 7.8 |
2025-01-06 | CVE-2024-45542 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver. | 7.8 |
2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |
2024-12-02 | CVE-2024-33044 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption while Configuring the SMR/S2CR register in Bypass mode. | 7.8 |
2024-12-02 | CVE-2024-33056 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption when allocating and accessing an entry in an SMEM partition continuously. | 7.8 |
2024-12-02 | CVE-2024-33063 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS while parsing the ML IE when a beacon with common info length of the ML IE greater than the ML IE inside which this element is present. | 7.5 |