Vulnerabilities > Qualcomm > Qcs605 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2021-02-22 | CVE-2020-11203 | Out-of-bounds Write vulnerability in Qualcomm products Stack overflow may occur if GSM/WCDMA broadcast config size received from user is larger than variable length array in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.1 |
2021-02-22 | CVE-2020-11198 | Improper Cross-boundary Removal of Sensitive Data vulnerability in Qualcomm products Key material used for TZ diag buffer encryption and other data related to log buffer is not wiped securely due to improper usage of memset in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.7 |
2021-02-22 | CVE-2020-11195 | Out-of-bounds Write vulnerability in Qualcomm products Out of bound write and read in TA while processing command from NS side due to improper length check on command and response buffers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.8 |
2021-02-22 | CVE-2020-11177 | Unspecified vulnerability in Qualcomm products User can overwrite Security Code NV item without knowing current SPC due to improper validation of SPC code setting and device lock in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 8.8 |
2021-02-22 | CVE-2020-11170 | Classic Buffer Overflow vulnerability in Qualcomm products Out of bound memory access while playing music playbacks with crafted vorbis content due to improper checks in header extraction in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 9.8 |
2021-01-21 | CVE-2020-11119 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can happen when the buffer length received from response handlers is more than the size of the payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
2020-11-12 | CVE-2020-3639 | Improper Validation of Array Index vulnerability in Qualcomm products u'When a non standard SIP sigcomp message is received from the network, then there may be chances of using more UDVM cycle or memory overflow' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009, APQ8017, APQ8037, APQ8053, MDM9250, MDM9607, MDM9628, MDM9640, MDM9650, MSM8108, MSM8208, MSM8209, MSM8608, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, QCM4290, QCM6125, QCS410, QCS4290, QCS603, QCS605, QCS610, QCS6125, QM215, QSM8350, SA415M, SA6145P, SA6150P, SA6155P, SA8150P, SA8155, SA8155P, SA8195P, SC7180, SC8180X, SC8180X+SDX55, SC8180XP, SDA429W, SDA640, SDA660, SDA670, SDA845, SDA855, SDM1000, SDM429, SDM429W, SDM439, SDM450, SDM455, SDM630, SDM632, SDM636, SDM640, SDM660, SDM670, SDM710, SDM712, SDM845, SDM850, SDX24, SDX50M, SDX55, SDX55M, SM4125, SM4250, SM4250P, SM6115, SM6115P, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM7250, SM7250P, SM8150, SM8150P, SM8350, SM8350P, SXR1120, SXR1130 | 9.8 |
2020-11-12 | CVE-2020-11209 | Incorrect Authorization vulnerability in Qualcomm products Improper authorization in DSP process could allow unauthorized users to downgrade the library versions in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439 | 5.5 |
2020-11-12 | CVE-2020-11208 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439 | 7.8 |
2020-11-12 | CVE-2020-11202 | Out-of-bounds Write vulnerability in Qualcomm products Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P | 7.8 |